An alleged image of the iPhone 18 Pro motherboard has leaked online, showing the A20 Pro chip will use a new packaging technology that should offer notable performance gains over the previous model. The leaked image, which has been shared by the accounts "WHYLAB" and "Ice Universe" on Weibo, appears to show the A20 Pro chip integrated into TSMC's new packaging architecture, known as Wafer-Level Multi-Chip Module (WMCM) technology.

An alleged image of the iPhone 18 Pro motherboard has leaked online, showing the A20 Pro chip will use a new packaging technology that should offer notable performance gains over the previous model. The leaked image, which has been shared by the accounts "WHYLAB" and "Ice Universe" on Weibo, appears to show the A20 Pro chip integrated into TSMC's new packaging architecture, known as Wafer-Level Multi-Chip Module (WMCM) technology.