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Technology
AMD Faces Patent Lawsuit Over 3D V-Cache Hybrid Bonding In Ryzen X3D CPUs
The non-practicing entity is seeking unspecified damages from the chipmaker over 10 supposed patent violations.
4 Nov 18:30 · HotHardware
AMD hit with patent lawsuit over hybrid bonding used in its 3D V-Cache processors
Adeia's complaints say AMD's recent 3D V-Cache processors rely on hybrid bonding, a method for connecting chips by directly joining planarized copper and dielectrics at fine pitch...
5 Nov 11:16 · TechSpot
last updated on 6 Nov 03:54